Packaging
- Custom Design & Development
- Wafer Processing
- Hybrid Integration
- Customized InP and GaAs Photodiodes, AWGs
- Packaging
- Foundry Capabilities
Enablence provides a variety of PLC packaging services based on Telcordia-qualified processes. Enablence provides control electronics and software solutions for its sub-systems products such as Reconfigurable Add/Drop Multimplexers (ROADM), VOA/Multiplexers (VMUX), and Tunable Optical Dispersion Compensators (TODC). Control electronics can be customized to serve specific requirements and are available in I2C, DPRAM or RS-232 format.
Our capabilities include:
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Multi-channel fiber pigtailing
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Specialty pigtails like polarization maintaining and bend-insensitive fibers
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Co-packaged electronics for drivers, amplifiers, switching, and thermal control
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Software/firmware design and development
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Chip-to-chip bonding
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Wire bonding
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Advanced chip-on-board packaging
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Complex hermetically sealed packages
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19” rack-mountable housings
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Complete optical testing services
Request a consultation to discuss your packaging requirements.