Hybrid Integration

One Stop Shop for Fully Integrated Solutions

Enablence offers a complete turn-key solution for delivering advanced integrated components thanks to our unique hybrid integration technology, expertise and facilities.

Hybridization of a variety of components is challenging due to their differing characteristics. Our hybrid integration approach integrates active components such as lasers and photodiodes directly onto Planar Lightwave Circuit (PLC) substrates. Each of these subcomponents can be bonded to the PLC at our foundries, using state-of-the-art flip-chip die bonders. This flexible approach can accommodate Fabry-Perot or DFB lasers, and PIN or APD photodetectors.

As part of this platform, Enablence also has the ability to fabricate key features onto our PLC optical chips, such as deep etched wells, 45° turning mirrors, and a variety of metal patterns for heaters, wirebonds, and electrical routing.

Our consultation services, combined with our vertically integrated approach to the development of components and subsystems, provide our customers with a level of agility and flexibility they cannot find anywhere else. They come back to Enablence time and again due to our exceptional technical capabilities, responsiveness and quick turnaround.

To learn more about how our hybrid integration capabilities can serve your core business objectives and project goals, please request a consultation to discuss your needs.