Packaging

Putting it all into the Right Package

Developing a specific custom component or sub-system to spec is only part of the process. Integrating that product into a package/enclosure that preserves its integrity, protects against environmental factors and ensures long-term reliability is the other.

Enablence provides a variety of PLC packaging services based on Telcordia-qualified processes. We offer control electronics and software solutions for our subsystems products.  Our control electronics can be customized to serve specific requirements and are available in I2C, DPRAM or RS-232 formats.

Our capabilities include:

• Multi-channel fiber pigtailing
• Specialty pigtails like polarization maintaining and bend-insensitive fibers
• Co-packaged electronics for drivers, amplifiers, switching, and thermal control
• Software/firmware design and development
• Chip-to-chip bonding
• Wire bonding
• Advanced chip-on-board packaging
• Complex hermetically sealed packages
• 19” rack-mountable housings
• Complete optical testing services

To learn more about how our custom packaging solutions can serve your core business objectives and project goals, please request a consultation to discuss your needs.