Packaging and Testing
Enablence provides a variety of PLC packaging services based on Telcordia-qualified processes. Advanced optical testing of PLC components is also available. Our capabilities include:
- Multi-channel fiber pig tailing
- Specialty pigtails such as polarization maintaining, visible wavelength and bend-insensitive fibers
- Co-packaged electronics for drivers, amplifiers, switching, and thermal control
- Software/firmware design & development
- Chip-to-chip bonding
- Wire bonding
- Advanced chip-on-board packaging
- Complex hermetically sealed packages
- 19” rack-mountable housings
- Complete optical testing services
