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Manufacture/Packaging Engineer

Position Overview:

We are looking for a senior level engineer in the area of electronic, optoelectronic, or photonic packaging or assembly. You are responsible to work independently as well as build and lead a  team to develop the manufacture process of integrated photonic products.  You may also be responsible to lead the effort to develop automated assembly equipment for volume production.

Responsibilities:

  • Take the ownership of key packaging processes including high precision die bonding, flip chip die bonding, wire bonding, fiber optic alignment, laser welding, …
  • Commercialize the integrated photonic packaging technique for volume production.
  • Develop automated equipment for photonic integration
  • Support or lead the new production introduction for volume production of integrated photonic products..
  • Develop quality assurance measures for the manufacture of integrated photonic products.

Requirements:

  • Senior expert in mechanical assembly (press fits, adhesive bonding, fastener selection)
  • Project leadership and ability to lead teams
  • A “hands-on” and interactive heuristic learner
  • Strong problem solving, teamwork, project management, and communication skills
  • Master degree or Phd in Manufacturing, Engineering, Packaging or equivalent work experience with evidence of exceptional ability.
  • 5-7 years’ proven manufacturing assembly engineering experience preferred
  • Being able to work a flexible schedule when dealing with critical production line issues

Please fill out below form to apply:









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