|          HOME

Manufacture Engineer

Position Overview:

We are looking for a senior level engineer in the area of advanced packaging or assembly technologies for electronics, optoelectronics, or photonics. The candidate is expected to be either an individual contributor or a team leader. He or she is to design and develop the manufacture process of advanced chip based hybrid integrated photonic products. He or she may also be responsible to develop automated assembly equipment for volume production.

Responsibilities:

  • Take the ownership of key packaging or assembly processes including high precision die bonding, flip chip die bonding, ball and wedge wire bonding, fiber optic alignment, laser welding, seam sealing. …
  • Familiar with quality system and reliability testing, lead product qualification test planning and execution, be able to develop quality control measures for volume production
  • Work with contract manufactures for NPI and production ramp, be able to implement new integrated photonic packaging techniques in volume production setting
  • Develop and commercialize specialized automation equipment
  • Manage the pilot or low volume production line for integrated photonic products

Requirements:

  • Master degree or Ph.D. in Science or Engineering field
  • At least 5 years’ experience in packaging, assembly, manufacturing of electronics, optoelectronics, or photonics product, experience integrated photonics preferred
  • A “hands-on” and interactive heuristic learner, solid knowledge is devices physics and electronics
  • Good experience in computer language, database, and automatic control techniques
  • Strong problem solving, teamwork, project management, and communication skills
  • Be able to travel and work a flexible schedule when dealing with critical issues

Please fill out below form to apply:









Attach Resume (.doc format)




captcha