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Hybrid Integration

Enablence offers unique hybrid integration technology that integrates active components such as lasers and photodiodes directly onto PLC substrates. Each of these sub-components can be bonded to the PLC at the Enablence facility, using state-of-the-art flip-chip die bonders. This provides a complete turn-key solution for delivering advanced integrated components.

This flexible approach can accommodate Fabry-Perot or DFB lasers, and PIN or APD photodetectors. As part of this platform, Enablence also has the ability to fabricate key features onto its PLC optical chips, such as deep etched wells, 45º turning mirrors, and a variety of metal patterns for heaters, wirebonds, and electrical routing.

Hybrid Integration