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Packaging and Testing

Enablence provides a variety of PLC packaging services based on Telcordia-qualified processes. Advanced optical testing of PLC components is also available. Our capabilities include:

  • Multi-channel fiber pig tailing
  • Specialty pigtails such as polarization maintaining, visible wavelength and bend-insensitive fibers
  • Co-packaged electronics for drivers, amplifiers, switching, and thermal control
  • Software/firmware design & development
  • Chip-to-chip bonding
  • Wire bonding
  • Advanced chip-on-board packaging
  • Complex hermetically sealed packages
  • 19” rack-mountable housings
  • Complete optical testing services

Packaging and Testing