Enablence USA Components has one of the most sophisticated and comprehensive PLC fabs in North America with more than twenty years of experience and a skilled engineering force. With its proprietary APCVD process, the fab can produce high volume, uniform PLC wafers with exceptional quality. The fab service extends from end-to-end wafer production to chip dicing, polishing, full testing and hybrid packaging of the PLC chips to modules / devices (to meet custom demands). It is ideal facility to produce volume products at low costs as well as custom prototype designs with special requirements.

We have provided fabrication services for applications including astronomy, data center, Lidar, industrial sensor(s), and virtual reality, among other things. Our fab services customers range from commercial companies to research institutions.

-Deposition

-Lithography

-Etching

-Post Processing (Dicing, Polishing, Assembly, Packaging)